Formula Design of Hyperbranched Polyarylether‐Based Low Dielectric Photosensitive Resin and Study of UV‐Cured Films Properties

ABSTRACT For large‐area electronic and high shape complexity structure applications, various solution‐processable materials are chosen as dielectric layer due to their simple molding process via spin‐coating, casting, or 3D printing at room temperature. Herein, the acrylic‐ended fluorinated hyperbranched polyaryletherketone ( hb ‐P6FAEK‐Ace) was used as the prepolymer and then, the composition of photosensitive resin formula was regulated by adjusting the addition ratio of hb ‐P6FAEK‐Ace and diluents (acrylimorpholine [ACMO] 1,6‐Hexanediol diacrylate [HDDA]). These photosensitive resin solutions showed the relative low viscosities ranged ranging from 18 to 253 mPa S at 100°C which was in favor of the future 3D printing method and printing accuracy. Then, the obtained UV‐cured films show the maximum tensile strength up to 71.9 MPa and superior thermal properties with the T g of 157°C–177°C and T 5% of 314°C–351°C. Moreover, they also exhibited the good dielectric performance with dielectric constants of 2.43–2.20 and dielectric loss of 0.013–0.014 at 1 MHz–1 GHz. These abovementioned satisfactory performance could be ascribed to the aromatic skeleton of hb ‐P6FAEK‐Ace, introduced polarizability‐CF 3 groups and the inner cavities for the hyperbranched structures, also the precise control of formula composition. Additionally, the curing degree, shrinkage of solid, and moisture properties were also researched thoroughly. This work provides a simple formula design though to construct the high performance and low dielectric photosensitive resin for the requirements of microelectronic applications.