Preparation of W–Cu composite with Cu-network structure via W-coated Cu powder structure optimization

This paper investigates the influence of the microstructure of W–Cu composite powders on the sintering behavior of W–Cu composite materials. Various doping methods were used to prepare W–Cu composite powders, which were subsequently sintered to produce the corresponding materials. The study indicates that employing solid-liquid doping, specifically adding tungsten oxide as the W source and copper nitrate as the Cu source, results in ultrafine W–Cu composite powders with a W-coated Cu structure. The sintered material derived from these composite powders exhibits a microstructure where Cu uniformly encapsulates the W particles. The resulting material achieves a density of up to 98.97 % and a microhardness of 304.04 Hv 0.2 . These findings provide significant insights that can inform the development of W–Cu composite materials for high-power electronic device encapsulation.