材料科学
陶瓷
导电体
碳化硅
复合材料
放电等离子烧结
电阻率和电导率
热导率
烧结
电气工程
工程类
作者
Zipeng Guo,Lu An,Saurabh Khuje,Aditya Chivate,Jiao Li,Yiquan Wu,Yong Hu,Jason N. Armstrong,Shenqiang Ren,Chi Zhou
标识
DOI:10.1016/j.addma.2022.103109
摘要
The development of electrically conductive ceramics could achieve robust mechanical strength as well as practically high conductivity, offering applications in structural electrodes, conductors, catalyst supports, etc. However, its operating temperature is limited due to the intrinsic dense structures inevitably hindering the thermal management capability, thus resulting in a temperature-dependent electrical behavior in high-temperature environments. We report an additive manufacturing protocol through vat photopolymerization 3D printing to fabricate the architectured conductive silicon carbide (SiC) ceramics that simultaneously possess high electrical conductivity as well as low thermal conductivity, and demonstrate electric reliability under high-temperature environments above 600°C. The percolation of graphene into the ceramic scaffold establishes a uniform conductive network, exhibiting its electrical conductivity up to 1000 S m−1. The bulk density of the 3D-printed ceramic is measured from 0.366 g cm−3 to 0.897 g cm−3, with thermal conductivity ranging from 62 mW m−1 K−1 to 88 mW m−1 K−1. Furthermore, the mechanical performance of conductive ceramic can be effectively reinforced by densifying the microstructures via spark plasma sintering treatment. The proposed additive manufacturing strategy widens the potential of ceramics as a structural and functional material, offering a promising pathway toward high-temperature electronics applications.
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