电子设备和系统的热管理
数码产品
材料科学
机械工程
热的
系统工程
电池(电)
透视图(图形)
可穿戴技术
热导率
热传导
热稳定性
能源管理
纳米技术
计算机科学
保温
材料设计
消散
可穿戴计算机
热能
散热膏
导电体
发热
工艺工程
电子元件
制造工程
高效能源利用
作者
Jianan Song,Guangxing Huang,Feng Wei,Lingxiao Sun,Chao Hu,Beibei Chen,Kan Zhang
标识
DOI:10.1021/acsami.6c10266
摘要
The rapid development of high-power electronics, flexible devices, and advanced energy systems has created a growing demand for thermal management materials that combine heat dissipation with additional functions such as electrical insulation, electromagnetic interference shielding, flame retardancy, mechanical compliance, and environmental stability or other application-specific functions. The central challenge in multifunctional thermal management materials (MTMMs) lies not simply in improving thermal conductivity but in integrating thermal management with other required functions within the same material system. From the perspective of functional integration, this review classifies MTMMs as passive or stimuli-responsive. Passive MTMMs rely on material composition, filler design, and structural construction to form heat-conduction pathways while supporting other functions. Stimuli-responsive MTMMs regulate heat transport and associated functional performance through reversible changes induced by electric or magnetic fields, light, or humidity. This classification clarifies the design logic, relationships among integrated functions, and applicability of different MTMM systems. Representative applications, including wearable electronics and battery thermal management, are also discussed to connect material design to practical requirements. Future research directions include recyclable MTMMs, long-term thermomechanical stability, and AI-assisted analysis of structure-function relationships. This review provides a systematic perspective for the development of next-generation thermal management materials.
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