阻带
带通滤波器
过渡带
电子工程
电子滤波器拓扑
原型滤波器
材料科学
滤波器(信号处理)
计算机科学
光电子学
声学
物理
工程类
电气工程
低通滤波器
作者
Bowei Liu,Gang Shi,Zicheng Wang,Shanwen Hu
出处
期刊:Frequenz
[De Gruyter]
日期:2025-06-10
卷期号:80 (1-2): 71-75
标识
DOI:10.1515/freq-2025-0067
摘要
Abstract A bandpass filter (BPF) designed for the 5G N77 band using low-temperature co-fired ceramic (LTCC) technology is presented in this paper. This proposed BPF incorporates a pair of hook-shaped microstrip feeding lines (HSMFLs) on the top layer and a T-junction resonator on the second layer. In order to realize a wider upper stopband, the HSMFL is composed of a stepped-impedance variation microstrip line (SIVML) and a folded microstrip line with enhanced coupling effect at the end. With a compact structure measuring 26.85 × 12.68 × 0.20 mm 3 , which equates to 0.689 × 0.325 × 0.005 λ g 3 , the design achieves an exceptional performance profile. The proposed BPF demonstrates superior performance with an out-of-band suppression higher than 20 dB up to 3.35 f 0 , while maintaining low in-band insertion loss (IL) under 0.3 dB. The proposed BPF offers significant potential for 5G mobile communications due to its wide upper stopband, exceptional out-of-band suppression capability, low in-band IL, simple design, and compact structure.
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