Microstructure and texture evolution of pure nickel during cryorolling and subsequent annealing

The microstructure and texture evolution of pure nickel sheets during cryorolling and subsequent short-time low-temperature annealing were analyzed by electron backscatter diffraction technique. Results show that the content of typical texture of brass, copper, S, cube, and Goss texture is no significant change during cryorolling with a reduction of 40%. When the reduction reaches 60%, it begins to significantly increase, and when the reduction reaches 80%, it exhibits a copper type texture. However, when the reduction is 20%, the fiber texture of <110>//normal direction (ND) orientation begins to significantly increase, which was mainly caused by dislocation slip during cryorolling. During low temperature and short time annealing, the content of typical textures decreases except S texture, and the grain changes mainly occur in grains other than <110>//ND orientation which is due to the rich substructure and high dislocation density formed in the cryorolling process leading to rapid response to annealing.