Effect of the Thickness Uniformity in Micro-Electroforming Process by Dividing Conductive Zone on Cathode
作者
Li Du,Li Chuan Yu,Lei Song,Chong Liu
出处
期刊:Advanced Materials Research [Trans Tech Publications] 日期:2009-01-01卷期号:60-61: 202-206被引量:2
标识
DOI:10.4028/www.scientific.net/amr.60-61.202
摘要
In this paper, an effective method is presented to improve thickness uniformity in nickel electroforming process. In most electroforming processes, thickness ratio of edge to center is 2.5~4 and the shape of the electroforming zone is naturally a concave. Dividing conductive zone of electroforming structure to redistribute current density was applied to improve electroforming uniformity. Theoretical analysis and experimental results verify that a proper dividing method can improve the electroforming uniformity effectively. In the experiment, the thickness ratio of edge to center decreases from 2.91 to 1.88.