Micromachined components for terahertz circuits and systems

This paper discusses the need for micromachined components in very high frequency (terahertz) electronic circuits. It is shown that, with the use of micromachining, conventional rectangular rectangular technology can be scaled down to the dimensions required for these high frequency circuits. Furthermore, the fabrication techniques are capable of producing the high quality surface necessary for low loss components. Fabrication processes are presented together with the results of electrical characterisation.