Inductively coupled plasma etching of (Pb,Sr)TiO/sub 3/ thin film in a Cl/sub 2//Ar plasma
作者
Goohwan Kim,D.P. Kim,K.T. Kim,C.I. Kim
标识
DOI:10.1109/plasma.2003.1229946
摘要
Summary form only given, as follows. In this study, an inductively coupled plasma etching system was used for etching PST thin films because of its high plasma density, low process pressure and easy control bias power.