Low-Temperature Fusible Silver Micro/Nanodendrites-Based Electrically Conductive Composites for Next-Generation Printed Fuse-Links

We systematically investigate the long-neglected low-temperature fusing behavior of silver micro/nanodendrites and demonstrate the feasibility of employing this intriguing property for the printed electronics application, i.e., printed fuse-links. Fuse-links have experienced insignificant changes since they were invented in the 1890s. By introducing silver micro/nanodendrites-based electrically conductive composites (ECCs) as a printed fusible element, coupled with the state-of-the-art printed electronics technology, key performance characteristics of a fuse-link are dramatically improved as compared with the commercially available counterparts, including an expedient fabrication process, lower available rated current (40% of the minimum value of Littelfuse 467 series fuses), shorter response time (only 3.35% of the Littelfuse 2920L030 at 1.5 times of the rated current), milder surface temperature rise (16.89 °C lower than FGMB) and voltage drop (only 24.26% of FGMB) in normal operations, easier to mass produce, and more flexible in product design. This technology may inspire the development of future printed electronic components.