Double‐Sided, Thin‐Film Microelectrode Array with Hemispheric Electrodes for Subretinal Stimulation

Abstract Components in neural implants, such as the electrode array and stimulator circuit, are often fabricated discretely. This modular fabrication scheme offers flexibility during development but poses difficulties during assembly, as components must be compactly integrated for implantation. It is particularly difficult in cases where the electrode array is required to have a high number of channels, such as in retinal prostheses. This paper presents the development of a parylene C‐based, double‐sided microelectrode array with 294 hemispheric electrodes for subretinal stimulation. The bonding pads on the bottom side of the double‐sided array are connected with electrodes through vias, eliminating the interconnection lines. The array can be integrated with a stimulator circuit through pad‐to‐pad bonding, resulting in a compact implant. The hemispheric electrodes are fabricated using thermally reflowed photoresist infillings, through which the height and width of the hemispheres can be easily controlled. The long‐term stability and biocompatibility of the materials and methods used to fabricate and package the electrodes are demonstrated in in vitro and in vivo environments over months. Finally, subretinal stimulation by the developed electrodes is successfully demonstrated using in vitro retinal patches from mice and monkeys.