Skeleton designable SGP/EA resin composites with integrated thermal conductivity, electromagnetic interference shielding, and mechanical performances

材料科学 复合材料 电磁干扰 电磁屏蔽 复合数 热导率 电磁干扰 环氧树脂 电子工程 工程类
作者
Qingyuan Du,Chenglin Li,Changhao Liu,Cheng Li,Guohua Chen,Ning Chen,Dezhen Wu,Jingyao Sun
出处
期刊:Composites Science and Technology [Elsevier]
卷期号:229: 109686-109686 被引量:10
标识
DOI:10.1016/j.compscitech.2022.109686
摘要

For the better operation of future electronic devices in complex situations, higher requirements of mechanical performance, especially bearing capacity, were put forward to functional composites. Therefore, the mechanical performance enhancement of functional composites had important practical application value. In this work, we reported a short carbon fiber-graphene nanoplatelets-polydimethylsiloxane (SGP)/epoxy acrylic resin (EA resin) composites with integrated thermal conductivity, electromagnetic interference (EMI) shielding, and mechanical performances using a combination method of 3D printing and vacuum impregnation. In the SGP/EA resin composite, EA resin skeleton with different cell shapes was responsible for the bearing capacity of composite samples, while the thermal conductivity and EMI shielding performance were provided by the SGP compound. When the cell shape of skeleton was circular and the filling contents in SGP compound was 15 wt% SCF and 6 wt% GNP, the SGP/EA resin composite presented best combination properties of 323.5 kPa compressive modulus, 2.13 W/(m·K) thermal conductivity, and 45.93 dB EMI shielding performance at 12.4 GHz. This work provided a facile, low-cost, and scalable method to fabricate composite samples with integrated thermal conductivity, EMI shielding, and mechanical performances. These multifunctional composites are highly promising for applications concerning heat dissipation, EMI shielding, and load-bearing devices.
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