79‐1: Invited Paper: Evaporation‐Induced Film Formation Control and Coffee‐Ring Effect Suppression for High‐Performance Printed Displays

In recent years, inkjet printing technology has demonstrated tremendous potential in the fabrication of novel display devices such as OLEDs and QLEDs, owing to its simple process, high efficiency, and low cost. Achieving uniform evaporation of droplets and consistent thin‐film formation is crucial for producing high‐performance printed devices. However, the evaporation and solidification of droplets on substrates involve complex thermal and mass transfer as well as energy exchange phenomena, with the capillary‐induced "coffee ring" effect particularly undermining the uniformity of the printed structures and emerging as a critical bottleneck. Although traditional control strategies—such as leveraging the Marangoni effect to induce fluid motion—can partially mitigate peripheral deposition, these approaches exhibit significant limitations in universality and process stability, especially under the demands of high‐precision processing. To address this technical challenge, significant breakthroughs have been made in the study of a multiscale regulation mechanism based on an interface capture strategy. This strategy dynamically captures solute particles to establish a competitive mechanism against capillary flow, thereby effectively reconstructing the particle deposition pathway. In this paper, we present an in‐depth analysis of the spatiotemporal evolution of the coffee ring effect, systematically review the limitations of existing suppression methods, and highlight the thermodynamic regulation mechanisms and technical advantages of the interface capture strategy. Specifically, we explore three physical control approaches—low‐pressure‐assisted evaporation suppression, thermal field control suppression, and active airflow‐enhanced interfacial diffusion control—to elucidate their mechanisms for reinforcing interface capture and their potential applications in the field of inkjet printing. These innovative methods provide novel technical pathways to overcome the manufacturing bottlenecks of high‐precision printed devices.