Development of Flexible Electronic Interlayer Material: Advancing by Protein‐Based Interfacial Adhesion

Flexible electronic devices have garnered significant attention due to their broad applications in electronic skin, flexible displays, wearable devices, and biomedical systems. However, the inherent chemical and mechanical mismatches between metal coatings and polymer substrates in these devices often result in interface misalignment, which severely compromises their stability. Moreover, frequent and repeated use causes stress in the conductive layer to exceed its fracture limit, leading to cracks that reduce device sensitivity. To overcome these challenges and drive advancements in flexible electronic devices, surface modification using amyloid‐like proteins has emerged as a promising approach to enhance both stability and functionality. This article reviews the design criteria for interfacial adhesion materials and highlights the latest developments in flexible electronic devices incorporating protein‐based aggregates. It begins with a brief introduction of interfacial adhesion materials, followed by an in‐depth discussion of the fundamentals of amyloid‐like aggregation, including their structure, formation processes, strategies for in vitro construction, and adhesive and mechanical properties. Finally, the recent progress of amyloid‐like aggregates as a surface modification technique for flexible electronic devices, sensors, and batteries is discussed, offering valuable insights and guidelines for achieving high‐performance devices with enhanced sensitivity, structural stability, and robust interface adhesion.