材料科学
涂层
微观结构
复合材料
铜
压痕硬度
电阻率和电导率
合金
硬度
薄板电阻
冶金
电导率
包层(金属加工)
导电体
图层(电子)
电气工程
工程类
物理化学
化学
作者
Yanmiao Li,Xiaojun Zhao,Pengyuan Zhai,Pengyu Fan,Jiahui Xu,Yuefan Xu,Zengkai Yu,Muyang Li,Yongtong Zhang,Dawei Gao,Sainan Liu,Zhenyang Cai,Lairong Xiao
出处
期刊:Materials
[Multidisciplinary Digital Publishing Institute]
日期:2023-12-20
卷期号:17 (1): 20-20
被引量:1
摘要
The pursuit of an advanced functional coating that simultaneously combines high hardness, wear resistance, and superior electrical conductivity has remained an elusive goal in the field of copper alloy surface enhancement. Traditional solid solution alloying methods often lead to a significant increase in electron scattering, resulting in a notable reduction in electrical conductivity, making it challenging to achieve a balance between high hardness, wear resistance, and high conductivity. The key lies in identifying a suitable microstructure where dislocation motion is effectively hindered while minimizing the scattering of conductive electrons. In this study, a novel Cu-MoSi2 coating was successfully fabricated on a CuCrZr alloy surface using the coaxial powder feeding high-speed laser cladding technique, with the addition of 10–30% MoSi2 particles. The coating significantly enhances the hardness and wear resistance of the copper substrate while maintaining favorable electrical conductivity. As the quantity of MoSi2 particles increases, the coating’s hardness and wear resistance gradually improve, with minimal variance in conductivity. Among the coatings, the Cu-30%MoSi2 coating stands out with the highest hardness (974.5 HV0.5) and the lowest wear amount (0.062 mg/km), approximately 15 times the hardness of the copper base material (65 HV0.5) and only 0.45% of the wear amount (13.71 mg/km). Additionally, the coating exhibits a resistivity of 0.173 × 10−6 Ω·m. The extraordinary hardness and wear resistance of these coatings can be attributed to the dispersion strengthening effect of MoxSiy particles, while the high electrical conductivity is due to the low silicon content dissolved into the copper from the released MoSi2 particles, as well as the rapid cooling rates associated with the high-speed laser cladding process.
科研通智能强力驱动
Strongly Powered by AbleSci AI