Creep properties of Sn‐0.7Cu composite solder joints reinforced with nano‐sized Ag particles

Purpose The purpose of this paper is to investigate the creep properties of Sn‐0.7Cu composite solder joints reinforced with optimal nano‐sized Ag particles in order to improve the creep performance of lead‐free solder joints by a composite approach. Design/methodology/approach The composite approach has been considered as an effective method to improve the creep performance of solder joints. Nano‐sized Ag reinforcing particles were incorporated into Sn‐0.7Cu solder by mechanically mixing. A systematic creep study was carried out on nano‐composite solder joints reinforced with optimal nano‐sized Ag particles and compared with Sn‐0.7Cu solder joints at different temperatures and stress levels. A steady‐state creep constitutive equation for nano‐composite solder joints containing the best volume reinforcement was established in this study. Microstructural features of solder joints were analyzed to help determine their deformation mechanisms during creep. Findings The creep activation energies and stress exponents of Ag particle‐enhanced Sn‐0.7Cu lead‐free based composite solder joints were higher than those of matrix solder joints under the same stress and temperature. Thus, the creep properties of nano‐composite solder joints are better than those of Sn‐0.7Cu solder joints. Originality/value The findings indicated that nano‐sized Ag reinforcing particles could effectively improve the creep properties of solder joints. A new steady‐state creep constitutive equation of nano‐composite solder joints was established. Deformation mechanisms of Sn‐0.7Cu solder and nano‐composite solder joints during creep were determined.