Brazing copper and alumina metallized with Ti-containing Sn0.3Ag0.7Cu metal powder

A Sn-based metallization layer was successfully prepared on the surface of alumina at 900 °C by using Ti-containing Sn0.3Ag0.7Cu (SAC, wt.%) metal powder. Reliable alumina/copper joints were obtained by brazing pre-metallized alumina and copper using SAC filler at 580–660 °C for 5 min. The typical interfacial microstructure of brazed joint was copper/Cu3Sn layer/Cu6Sn5 layer/β-Sn layer containing Ti6Sn5 phase and Al2O3 particles/alumina. As brazing temperature increased, the Cu–Sn intermetallic layers thickened rapidly and the amount of β-Sn phase reduced. When brazing temperature exceeded 640 °C, Kirkendall voids and microcracks formed at copper/Cu3Sn interface. The joints brazed at 580–620 °C possessed high shear strength and the highest average shear strength of 32 MPa was achieved when brazed at 620 °C. Fracture analyses indicated that the joints mainly fractured inside of the Cu6Sn5 layer and β-Sn layer. The joints brazed above 620 °C demonstrated low shear strength due to the formation of Kirkendall voids which caused the joints fractured along the Cu/Cu3Sn interface.