Molecular self-assembly of novel amphiphilic topological hyperbranched polymers for super protection of copper in extremely aggressive acid solution

Novel topological hyperbranched polymers (THPs) with large polymer molecular weight and narrow polydispersities are synthesized in this study by using 1,3,5-tri(methyl bromide)-benzene and phenylmethyl-linked bisimidazole or triimidazole as the starting monomers. The results show that the THPs can process regular molecular assembly in mixed ethanol/sulfuric acid aqueous solution. The sizes and morphologies of the THPs aggregates are shown dependence on the assembly concentrations and aggregation evolution time. The Cu(I)-N chemical bonding formed by the THPs assemblies and copper ions is demonstrated by the comprehensive surface analysis, and the bonding makes the primary contribution to produce chemisorption layer on copper substrate. The electrochemical measurements reveal the super copper corrosion inhibition capability of the robust THPs assemblies protective layers in sulfuric acid solution. In addition, the effects of corrosion temperature on corrosion resistance, the kinetic parameters and the Langmuir isotherms indicate the possible presence of physisorption. The adsorption process of THPs aggregates on copper surface is further understood by the molecular modeling and the molecular dynamics simulation. The gained results in this study could provide a new thought of designing and synthesizing benign and effective polymer materials for anti-corrosion copper in harsh aggressive acid media.