纳米流体
材料科学
热导率
光电子学
热阻
强化传热
热的
复合材料
功率密度
传热
大功率led的热管理
工作温度
电子设备和系统的热管理
堆栈(抽象数据类型)
石墨烯
表面粗糙度
结温
对流
对流换热
传热系数
鳍
水冷
表面光洁度
机械工程
电子工程
作者
Yafan Qin,Jingtan Chen,Xing Yang,Yong Yan,Shikun Zheng,Xiaofei Ma,Meng Wang,Congsi Wang
出处
期刊:Micromachines
[Multidisciplinary Digital Publishing Institute]
日期:2026-03-27
卷期号:17 (4): 410-410
摘要
The escalating power density in Active Phased Array Radar has made the thermal management of Transmitter and Receiver (T/R) modules a critical bottleneck for radar performance. To address the thermal resistance of traditional cold plates, this study investigates an innovative embedded cooling strategy utilizing micro-pyramid arrays and advanced nanofluids. Thermal performance was evaluated using maximum temperature, maximum temperature difference and surface temperature standard deviation (ST). Higher pyramid density markedly enhances temperature uniformity, an effect that scales positively with the power load. Under a 100 W condition, the 8-circle micro-pyramids configuration (the densest structure with roughness Ra = 1.3) achieved a 22.58 K reduction in maximum temperature and a 22.5% improvement in temperature uniformity compared to the 2-circle structure, and outperformed the 4-circle structure by 16.98 K and 17.9%, respectively. Furthermore, a comparative analysis of nanofluids (Al2O3, CuO, graphene, and h-BN) is conducted and it is found that graphene nanofluid exhibits the best overall heat transfer enhancement because of its high thermal conductivity and moderate reduction in specific heat capacity. The thermal performance of the nanofluid is evaluated by comparing the maximum temperatures of the heat source at the 8-circle structure. The synergistic coupling of graphene nanofluid with the 8-circle array yields a remarkable 35.38% enhancement in temperature uniformity at 100 W. The enhancement mechanisms are mainly attributed to intrinsic thermophysical properties of the nanoparticles and convection caused by denser pyramid array. The aforementioned findings provide important guidance for the thermal management design of antenna and other high-density integrated electronic systems with embedded cold plate design demand.
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