Photonics Heterogeneous Integration (PHI) of Thin-Film Lithium Niobate and Hydrogen-Free Silicon Nitride on a 200-mm Silicon Photonics Platform

We demonstrate 200-mm wafer-scale photonic heterogeneous integration platform comprising TFLN modulator and hydrogen-free SiN using die-to-wafer bonding. High-efficiency light transmission between SiN and TFLN waveguides is demonstrated using MZI modulator with 2.9 V·cm modulation efficiency.