微通道
散热片
模糊逻辑
压力降
传热
控制理论(社会学)
机械
计算流体力学
制冷剂
热流密度
计算机科学
变压器
雷诺数
材料科学
入口
工程类
消散
机械工程
流体力学
电子设备和系统的热管理
联轴节(管道)
离散化
模拟
作者
Xicheng Zhang,Ling Lin,Shiquan Feng
标识
DOI:10.1080/19942060.2026.2703930
摘要
High local heat flux significantly reduces the reliability and lifespan of electronic chips. Most existing microchannel heat sinks (MCHSs) are single solid structures. Such a structure reduces heat transfer area and fails to generate sufficient fluid disturbance. Published surrogate models cannot effectively characterise the uncertainties in sample data. Therefore, four new hybrid pin-fin microchannel heat sinks (NHPFMCHSs) are proposed. The computational fluid dynamics (CFD) simulations show that all four NHPFMCHSs significantly reduce maximum and average temperatures compared with the non-hybrid straight microchannel heat sink (NHSMCHS). The four-leaf-clover-like Case 4 achieves the best comprehensive performance under different Reynolds numbers (Re). This model uses four-leaf-clover-inspired pin-fins in the central region to enhance heat dissipation and straight-fins at the inlet and outlet to reduce pressure drop (Δp). Then, this paper, for the first time, presents a coupling of an improved fuzzy Transformer model with an enhanced shuffled frog leaping algorithm for the optimisation of Case 4. A fuzzy strategy is adopted to identify the uncertainty characteristics in the samples. Compared with BP and ANN, the proposed improved fuzzy Transformer model reduces the RMSE for Tmax by 38.89% and 33.33%, and for Δp by 48.96% and 39.68%, respectively. Compared with NHSMCHS, further optimisation of Case 4 leads to scheme No.15, which reduces the average Tmax by 8.74 K and increases the average Performance Evaluation Criterion (PEC) by 1.41 for all Re values.
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