Research for the development of advanced packaging material testing technology and standardization

This paper focuses on the analysis of testing and analysis technology for the main and auxiliary advanced integrated circuit packaging materials, and the main standards developed by SEMI, ASTM, IEC and domestic standard committees. The concrete research contents involve the test and analysis standard index system of major materials, main materials test methods and development of test and analysis equipment, including interface thermal conductivity materials, packaging substrate, plastic sealing material, electroplating solution, micro-connection materials, through silicon hole related materials, etc., As the same time, this paper summarizes the shortcomings of the current advanced packaging material testing technology and standardization, and put forward suggestions for the development of the industry.