材料科学
聚合物
闭环
印刷电路板
循环(图论)
纳米技术
3d打印
复合材料
生物医学工程
控制工程
电气工程
工程类
数学
组合数学
作者
Wenjie Wang,Xue Ming Lü,Yixuan Li,Xiang Li,Haoxiang Sun,Junqi Sun
标识
DOI:10.1002/adfm.202401822
摘要
Abstract It remains a huge challenge to efficiently recycle the printed circuit boards (PCBs) because of the diversity and complexity of the PCBs in terms of material composition. The recycling of PCBs highly depends on the design of the polymers that make up the polymer substrates and conductive pastes. Herein, closed‐loop recyclable plastics for use as the polymer substrates and for the preparation of the conductive pastes are fabricated by dynamically cross‐linking phenylboronic acid‐functionalized poly(methylmethacrylate) (PMMA‐B) and poly(urea‐urethane) (PUU‐B) with boroxines. The closed‐loop recyclable plastic, which is denoted as PMMA‐PUU exhibits a breaking strength of 71.0 MPa and Young's modulus of 1.8 GPa. Because of the dynamic nature of boroxines, the PMMA‐PUU 0.6 plastic can be depolymerized in the N, N‐dimethylacetamide/ethanol mixture solvent. The depolymerized PMMA and PUU can be efficiently recovered in high yields and purity through their solubility differences in selective solvents. Conductive pastes suitable for printing of electrical circuits are fabricated through complexation of Ag particles with PMMA‐PUU. PCBs composed of PMMA‐PUU substrates and PMMA‐PUU‐based conductive pastes are flexible, healable, and recyclable. The closed‐loop recycling of the PCBs enables the collection of highly purified Ag particles, PMMA‐B, and PUU‐B monomers even when the PCBs are mixed with polymer wastes.
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