Key technologies for laser-assisted precision grinding of 3D C/C-SiC composites

Due to their exceptional and distinctive qualities, 3D C/C-SiC composites are widely utilized in producing high-end equipment and the aerospace national defense industries. However, the hard and pseudo plastic nature of the material and its anisotropies make it challenging to process. To improve the processing quality of 3D C/C-SiC composites, laser-assisted precision grinding technology is introduced in this paper, which innovatively controls the depth of the thermally induced damage layer by adjusting the laser process parameters to reduce the hard brittleness of the material, and then the surface is created by precision grinding with a grinding wheel on this basis. Experiments on laser-induced damage, laser-assisted grinding, and diamond scratching were carried out to investigate the effect of laser parameters on material damage and the effect of laser-assisted grinding processes, with an emphasis on revealing the mechanism of material removal. The results show that laser irradiation causes complex reactions such as sublimation, decomposition, and oxidation of 3D C/C-SiC composites, resulting in SiO2 and Si and recondensed SiC, causing surface/subsurface damage. A maximum reduction in normal grinding force, tangential grinding force, specific grinding energy, and surface roughness of 35.6%, 43.6%, 43.58%, and 24.22%, respectively, compared to conventional grinding processes with laser-assisted grinding. After laser irradiation, the degree of brittle fracture in the precision grinding of workpieces is significantly reduced due to the degradation of matrix and fiber damage caused by laser irradiation, which reduces the hard and pseudo plastic properties of the material. The removal mechanism shows a trend of ductile domain removal in the grinding of thermally damaged layers, which reduces the grinding force and improves the surface quality.