Experimental investigation of heat transfer and pressure drop in copper manifold microchannel heat sinks

Over the past decade, various two-phase cooling solutions have been implemented to dissipate power in high heat flux electronic components. The manifold microchannel heat sink is an efficient thermal management solution that reduces heat resistance while also limiting the pumping power. However, there is limited work available on small form factor manifold microchannels with traditional heat sinking materials like copper. In this study, an experimental investigation is conducted to evaluate the heat transfer and pressure drop performance of copper manifold microchannel heat sinks using an environmentally friendly refrigerant, R1233zd(E), as the working fluid. A microchannel plate and a manifold plate, both made of oxygen-free copper, are sandwiched together to form the manifold microchannel test sample assembly. To compare the effects of geometric parameters, a total of six manifold microchannel test samples are investigated, including two types of manifold plates and three types of microchannel plates. The experiments are performed with refrigerant mass flow rates ranging from 5 to 15 g/s and inlet subcooling temperatures ranging from 3 to 10 K. The heat transfer coefficient increases with a decreasing number of manifolds and with an increase in the number and width of the microchannels. The pressure drop decreases in configurations with more microchannels, more manifolds, and larger microchannel widths. Compared to traditional microchannels, manifold microchannels significantly reduce the total pressure drop. However, their heat transfer performance at higher heat flux conditions is limited by the trapped bubbles phenomena. In comparison to traditional microchannels, manifold microchannels demonstrate much higher performance in dissipating the same amount of heat flux while limiting pumping power, as indicated by the COP.