制作
微流控
气泡
材料科学
电阻器
纳米技术
热的
光电子学
电气工程
工程类
计算机科学
电压
替代医学
并行计算
气象学
病理
物理
医学
作者
Brandon Hayes,Lawrence C. Smith,Heiko Kabutz,Austin C. Hayes,Gregory L. Whiting,Kaushik Jayaram,Robert MacCurdy
出处
期刊:Micromachines
[Multidisciplinary Digital Publishing Institute]
日期:2022-09-29
卷期号:13 (10): 1634-1634
被引量:14
摘要
Thermal bubble-driven micro-pumps are an upcoming actuation technology that can be directly integrated into micro/mesofluidic channels to displace fluid without any moving parts. These pumps consist of high power micro-resistors, which we term thermal micro-pump (TMP) resistors, that locally boil fluid at the resistor surface in microseconds creating a vapor bubble to perform mechanical work. Conventional fabrication approaches of thermal bubble-driven micro-pumps and associated microfluidics have utilized semiconductor micro-fabrication techniques requiring expensive tooling with long turn around times on the order of weeks to months. In this study, we present a low-cost approach to rapidly fabricate and test thermal bubble-driven micro-pumps with associated microfluidics utilizing commercial substrates (indium tin oxide, ITO, and fluorine doped tin oxide, FTO, coated glass) and tooling (laser cutter). The presented fabrication approach greatly reduces the turn around time from weeks/months for conventional micro-fabrication to a matter of hours/days allowing acceleration of thermal bubble-driven micro-pump research and development (R&D) learning cycles.
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