Temperature compensation study of pressure sensors after leadless packaging

Purpose The purpose of this paper is to reduce the problem of temperature drift causing output errors in such sensors, three hardware compensation schemes are proposed in this paper, and three compensation schemes are designed and implemented. Design/methodology/approach In response to the problem of temperature drift causing output errors in this type of sensor, this paper proposes three hardware compensation schemes and carries out the design and implementation of the three compensation schemes. Finally, the advantages and disadvantages of the three compensation schemes are discussed through the analysis of the experimental results. The three hardware compensation methods are series-parallel resistance network compensation, digital signal processor (DSP) compensation and the joint compensation of resistance network and DSP. Series parallel resistance network compensation is to connect the low-temperature drift resistance and the sensor in series and parallel; DSP compensation is based on the combination of cubic spline interpolation and linear fitting algorithm, which uses DSP to process the data. Joint compensation is a new compensation method composed of the above two compensation methods. Findings The experimental results show that the relative error of the output is reduced to a certain extent after the three compensation methods, and the relative error of the output after the joint compensation is reduced to about 0.2%, which proves that the three compensation methods are feasible. Originality/value This paper presents three novel hardware compensation methods to reduce temperature drift in silicon on insulator (SOI) high-temperature pressure sensors. The joint compensation method, combining resistance network and DSP compensation, is particularly innovative and significantly improves output accuracy, reducing relative error to about 0.2%.