A review of diamond interfacial modification and its effect on the properties of diamond/Cu matrix composites

Diamond/Cu composites have great potential applications in thermal management for its high thermal conductivity (TC), low expansion, good heat and corrosion resistance. However, the weak interfacial bonding between diamond and Cu often deteriorates its properties and interface modification design is considered as an effective way to improve its interface strength and reduce its thermal resistance. In this paper, interface modifying elements were divided into low solid-solution elements and high solid-solution elements according to their solubility in the copper matrix, and the effects of different elements on TC of diamond/Cu composites are discussed. Then, the theoretical models of the TC mechanism of diamond/Cu matrix composites are analyzed. Finally, the future development direction and possible challenges are summarized.