材料科学
光电子学
晶体管
可靠性(半导体)
热离子发射
高电子迁移率晶体管
击穿电压
缓冲器(光纤)
电场
氮化镓
电压
高压
功率(物理)
电子
电气工程
纳米技术
图层(电子)
工程类
物理
量子力学
作者
An-Chen Liu,Pei-Tien Chen,Chia-Hao Chuang,Yan-Chieh Chen,Yanlin Chen,Hsin‐Chu Chen,Shu-Tong Chang,I‐Yu Huang,Hao‐Chung Kuo
出处
期刊:Electronics
[MDPI AG]
日期:2024-05-30
卷期号:13 (11): 2143-2143
被引量:1
标识
DOI:10.3390/electronics13112143
摘要
In this study, we demonstrate breakdown voltage at 1500 V of GaN on a QST power device. The high breakdown voltage and low current collapse performance can be attributed to the higher quality of GaN buffer layers grown on QST substrates. This is primarily due to the matched coefficient of thermal expansion (CTE) with GaN and the enhanced mechanical strength. Based on computer-aided design (TCAD) simulations, the strong electric-field-induced trap-assisted thermionic field emissions (TA-TFEs) in the GaN on QST could be eliminated in the GaN buffer. This demonstration showed the potential of GaN on QST, and promises well-controlled performance and reliability under high-power operation conditions.
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