材料科学
共晶体系
微观结构
热导率
三元运算
合金
粒度
电阻率和电导率
冶金
晶界
热力学
复合材料
电气工程
程序设计语言
工程类
物理
计算机科学
作者
Xun Zhang,Yuli Zhou,Gu Zhong,Junchao Zhang,Yunan Chen,Wanqi Jie,Peter Schumacher,Jiehua Li
标识
DOI:10.1007/s10853-022-07045-7
摘要
Abstract Effects of Si and Sr on solidification microstructure and thermal conductivity of Al–Si binary alloys and Al–9Si–Sr ternary were investigated, respectively, with a special focus on the relationship between solidification microstructure and thermal conductivity. It was found that (i) in Al–Si binary alloys, with increasing Si content, α-Al grain size increases and then decreases when Si content is over 7 wt%, while the percentage of eutectic Si continuously increases, which significantly decreases the thermal conductivity and electrical conductivity, and (ii) in Al–9Si–Sr ternary alloys, the presence of Sr has no significant effect on α-Al grain, but effectively modifies eutectic Si and significantly improves the thermal and electrical conductivity. On this basis, two theoretical calculation models [the Maxwell model and the Hashin–Shtrikman (H–S) model] were used to elucidate the relationship between solidification microstructure and thermal conductivity. Compared with the Maxwell model, the H–S model fits better with the measured values. The obtained results are very helpful to the precise composition control during alloy design and recycling of Al–Si-based alloys with the aim to further improve the thermal conductivity of Al–Si-based alloys. Graphical abstract
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