Effects of Si and Sr elements on solidification microstructure and thermal conductivity of Al–Si-based alloys

材料科学 共晶体系 微观结构 热导率 三元运算 合金 粒度 电阻率和电导率 冶金 晶界 热力学 复合材料 电气工程 程序设计语言 工程类 物理 计算机科学
作者
Xun Zhang,Yuli Zhou,Gu Zhong,Junchao Zhang,Yunan Chen,Wanqi Jie,Peter Schumacher,Jiehua Li
出处
期刊:Journal of Materials Science [Springer Nature]
卷期号:57 (11): 6428-6444 被引量:16
标识
DOI:10.1007/s10853-022-07045-7
摘要

Abstract Effects of Si and Sr on solidification microstructure and thermal conductivity of Al–Si binary alloys and Al–9Si–Sr ternary were investigated, respectively, with a special focus on the relationship between solidification microstructure and thermal conductivity. It was found that (i) in Al–Si binary alloys, with increasing Si content, α-Al grain size increases and then decreases when Si content is over 7 wt%, while the percentage of eutectic Si continuously increases, which significantly decreases the thermal conductivity and electrical conductivity, and (ii) in Al–9Si–Sr ternary alloys, the presence of Sr has no significant effect on α-Al grain, but effectively modifies eutectic Si and significantly improves the thermal and electrical conductivity. On this basis, two theoretical calculation models [the Maxwell model and the Hashin–Shtrikman (H–S) model] were used to elucidate the relationship between solidification microstructure and thermal conductivity. Compared with the Maxwell model, the H–S model fits better with the measured values. The obtained results are very helpful to the precise composition control during alloy design and recycling of Al–Si-based alloys with the aim to further improve the thermal conductivity of Al–Si-based alloys. Graphical abstract

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