Multi Beam Grooving and Full Cut Laser Dicing of IC Wafers

Since wafer technologies have dropped below 90nm node and low k materials were introduced it became clear that blade dicing evolution came to an end and expensive hybrid solutions were required to achieve the desired product reliability. Similar situations have been seen with the ongoing trend to thinner wafer that are needed for 3D packaging. To achieve sufficient mechanical strength, complex dicing technologies and sequences have been introduced which do not respond to the requirements for current and near future technologies. This paper will discuss the multiple beam laser dicing technology, an enabling technology that allows semiconductor manufacturers to execute the technology roadmap and continue to comply to Moore's law in an efficient manner. The paper will demonstrate how challenges have been addressed using the multi beam technology. The multiple beam laser dicing technology has already been widely adopted by several other semiconductor technologies and has a proven track record.