Low dielectric epoxy resins from dicyclopentadiene-containing poly(phenylene oxide) novolac cured with dicyclopentadiene containing epoxy

Abstract Dicyclopentadiene-containing low molecular weight poly(phenylene oxide) (PPO) novolac (DCPD-PPO) was prepared by redistributing regular PPO with dicyclopentadiene phenol novolac (DCPDNO), using benzoyl peroxide (BPO) as an initiator in toluene. The synthesized dicyclopentadiene-containing redistributed-PPO novolac (DCPD-PPO) with terminal phenolic hydroxyl group and low molecular weight was used in the modification of dicyclopentadiene containing epoxy (DCPD-epoxy)/4,4′-diamino-diphenylmethane (DDM) network system. The thermal and dielectric properties of the cured DCPD-PPO/DCPD-epoxy system were compared with those of bisphenol A containing DCPD-PPO/BPA-epoxy or BPA-PPO/DCPD-epoxy systems. In addition to, a higher glass transition temperature and thermal stability, the cured DCPD-PPO/DCPD-epoxy resins exhibit lower dielectric constant, dissipation factor, coefficient of thermal expansion and moisture absorption than those of bisphenol A based redistributed-PPO/epoxy.