材料科学
复合材料
微观结构
纤维
极限抗拉强度
热导率
热膨胀
复合数
体积分数
多孔性
作者
H. M. Yun,James A. DiCarlo
出处
期刊:Ceramic engineering and science proceedings
日期:2008-03-26
被引量:3
标识
DOI:10.1002/9780470291191.ch12
摘要
CMC hot-section components in advanced aero and space propulsion systems will typically require high mechanical performance (cracking strength, ultimate strength and strain, and creep-rupture resistance) for all directions in which the component will experience significant service-related stresses. In addition, the CMC should display high through-thickness thermal conductivity and be fabricated in thin sections in order to reduce stresses due to through-thickness thermal gradients. Thus CMC component microstructures, fiber architectures, and wall thicknesses need to be optimized to maximize these properties. The objective of this study was to measure, as a function of temperature, the effects of different microstructures and fiber architectures on the in-plane stress-strain behavior, thru-thickness tensile strength, and thermal conductivity of thin SiC/BN/SiC composite panels. Key variables included fiber type, fiber volume fraction, fiber architectures, BN interphase volume fraction, fiber-interphase-matrix bonding, matrix type, matrix composition, and matrix porosity. Fiber architectures primarily included those formed from random 2D fabric lay-up. The matrix types evaluated were partial CVI SIC plus slurry-cast MI SiC/Si, full PIP SiC, and full CVI SiC. The property results are interpreted in terms of underlying mechanisms. Approaches for optimizing the through-thickness behavior of SiC/SiC CMC are discussed.
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