Thermal Analysis of Multi-Chiplet Heterogeneous Integration Based on the Lidless Fan-Out Package

The fan-out package with many distinct advantages is widely adopted for the state-of-the-art mobile applications and has great potential in the server applications. In this paper, the lidless structure with an heatsink directly integrated on the fan-out package is proposed as the efficient thermal dissipation solution with low thermal resistance at package and system level. The thermal modelling and characterization of the lidless fan-out package with SoC and Memory is carried out.