材料科学
聚醚酰亚胺
复合材料
抗弯强度
热塑性塑料
热固性聚合物
偷看
硅
碳化硅
纤维
碳化
聚合物
扫描电子显微镜
冶金
作者
Florian Reichert,Nico Langhof,Walter Krenkel
出处
期刊:Materials Science Forum
日期:2015-07-01
卷期号:825-826: 232-239
被引量:6
标识
DOI:10.4028/www.scientific.net/msf.825-826.232
摘要
C/C-SiC composites, fabricated by the Liquid Silicon Infiltration process (LSI), typically use phenolic resin-based thermosets as carbon precursors. In contrast to this, two different thermoplastics (Polyetheretherketone PEEK and Polyetherimide PEI) were examined for their suitability as carbon precursors for C/C-SiC composites. The carbon fiber surfaces were pretreated between 400 °C and 800 °C in nitrogen atmosphere to modify the fiber/matrix bonding. The microstructures of the materials show an increasing SiC content with increasing fiber pretreatment temperature. The flexural strength of the resulting material was determined by 4-point-bending tests.
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