Fabrication and electrical characteristics of Ti/Al OHMIC contact to Si+ implanted GaN

Ti/Al ohmic contact with an extremely low specific contact resistance has been formed by the deposition of Ti and Al films on Si+ lanted GaN. The ohmic contact formed by annealing at 600 o C of Ti film with a thickness of 50 nm and Al film with a thickness of 200 nm reveals the good smooth surface and uniform structure as compare to those of contacts formed above 700 °C, which is correlated to whether the Al-Ti alloy is melted during the annealing of ohmic contact or not. The specific contact resistance of 2 × 10−6Ω−cm2 is obtained for Si+ implanted GaN with a dose of 5 × 1013 cm−2. As Si ion dose increases to 5 × 1014 /cm2, the specific contact resistance is reduced to 2 × 10−8 Ω−cm2. It is revealed that the selective doping at high impurity concentration in the surface region by Si+ implantation is useful to reduce the contact resistance for Ti/Al contact to GaN.