铆钉
机身
垂直的
强度因子
GSM演进的增强数据速率
压力(语言学)
结构工程
强度(物理)
平面(几何)
材料科学
直线(几何图形)
几何学
工程类
断裂力学
复合材料
光学
物理
数学
电信
哲学
语言学
出处
期刊:Ludwig Maximilian University of Munich - Munich Personal RePEc Archive
日期:1977-05-01
摘要
The compounding technique of obtaining stress intensity factors is applied to cracks at the edge of one hole in a row of periodically spaced holes. The cracks (one or two) lie along the line of holes and perpendicular to the uniform stress which is applied remote from the holes. This configuration models cracks at rivet holes in airframe structures reinforced with riveted stiffeners, if there is little in-plane load-transfer through the rivets. A particular feature of the solution is high accuracy of the results at short crack lengths - a necessary requirement for the reliable estimation of the lifetimes of growing cracks. (Author)
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