材料科学
弯曲
曲率
集成电路
屈曲
基质(水族馆)
复合材料
变形(气象学)
炸薯条
扫描电子显微镜
结构工程
接口(物质)
光电子学
工程类
电气工程
几何学
地质学
海洋学
毛细管作用
数学
毛细管数
作者
Ying Chen,Jianghong Yuan,Yingchao Zhang,Yonggang Huang,Xue Feng
摘要
The interfacial failure of integrated circuit (IC) chips integrated on flexible substrates under bending deformation has been studied theoretically and experimentally. A compressive buckling test is used to impose the bending deformation onto the interface between the IC chip and the flexible substrate quantitatively, after which the failed interface is investigated using scanning electron microscopy. A theoretical model is established based on the beam theory and a bi-layer interface model, from which an analytical expression of the critical curvature in relation to the interfacial failure is obtained. The relationships between the critical curvature, the material, and the geometric parameters of the device are discussed in detail, providing guidance for future optimization flexible circuits based on IC chips.
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