聚氨酯
材料科学
复合材料
分离式霍普金森压力棒
灌封
应变率
硬化(计算)
休克(循环)
应变硬化指数
拉伤
结构工程
内科学
图层(电子)
医学
工程类
作者
Amandeep Singh,V. D. Shivling,P.K. Khosla,Ashish Saini,Vijay Kumar,Ankur Trigunayak
出处
期刊:AIP Advances
[American Institute of Physics]
日期:2021-11-01
卷期号:11 (11)
被引量:7
摘要
Polyurethane is a promising candidate for the potting of embedded electronics due to its shock absorbing properties. This paper discusses the less known strain hardening and shock mitigation properties of 4,4′-methylenediphenyl diisocyanate based polyurethane under dynamic loading. This study is reported in a strain rate range of 1600–2900 s−1 under compression using a split-Hopkinson pressure bar (SHPB). The experimental stress–strain behavior of polyurethane was modeled with Hollomon’s equation to analyze its hardening behavior in dynamic environments. Jointly, the incident, reflected, and transmitted strain signals of the SHPB are analyzed in time and frequency domains to understand the shock absorbing properties of polyurethane. Polyurethane was found to absorb more shock for more intense loading. It was observed to mitigate 81% of shock energy with frequencies up to 10 kHz.
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