Effect of grinding residual height on the surface shape of ground wafer

In ultra-precision grinding of the wafer, most existing studies on wafer shape control only consider the kinematic relationship between grinding wheel and wafer, but the influence of grinding residual height on wafer grinding shape cannot be ignored. In this paper, the formula for the distance between the grinding marks formed by adjacent grains was established. Afterward the model of residual height and the model of wafer shape considering the influence of residual height were established. Methods to enhance the flatness of the ground wafer were put forward by changing the process parameters, and changing the inclination angles of the grinding wheel shaft. The residual height under different parameters and the inclination angles needed to offset the influence of residual height on the wafer shape were simulated and analyzed. Finally, the trial experiments were conducted to verify the proposed methods and the wafer shape model. The study outcomes will provide helpful instruction for ameliorating the flatness of the wafer.