材料科学
复合材料
热导率
复合数
氮化硼
导电体
热的
壳体(结构)
硫化物
物理
气象学
冶金
作者
Yue Jiang,Yujing Liu,Min Peng,Guoxin Sui
标识
DOI:10.1016/j.compscitech.2017.03.023
摘要
Hexagonal boron nitride (h-BN) presents an excellent thermal conductivity and the outstanding insulating property for electronic packaging. However, a traditional method can enhance the thermal conductivity of the composites by melt mixing fillers and polymers usually leading to composites with limited thermal conductivity. Here, [email protected] (Polyphenylene sulfide) core-shell structure particles and their composites with the 3D segregated architecture are presented. The composite achieves a high thermal conductivity of 4.15 W/mK containing 40 vol% BN, which is 16 times higher than that of PPS resin of ∼0.25 W/mK and 1.69 times higher than that PPS/BN blend composite with at the same BN loading of 2.45 W/mK. The outstanding thermally conductive property of segregated architecture PPS/BN composite is attributed to the formation of BN flakes networks in the PPS matrices, which can provide effective thermal conductive pathway. This segregated architecture composite is an optimal material for insulating electronic packaging.
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