Synergistical Effects of Mg Microalloying, Deformation, and Aging on the Strength and Electrical Conductivity of Cu‐3.3 wt%Ti Alloy

材料科学 合金 电阻率和电导率 变形(气象学) 冶金 复合材料 电气工程 工程类
作者
Kuo Yang,Mingxing Guo,Hu Wang,Yongda Mo,Miaomiao Wang,Fang Liu,Yunpeng Wang,Dong Liang,Huafen Lou
出处
期刊:Advanced Engineering Materials [Wiley]
卷期号:27 (1) 被引量:12
标识
DOI:10.1002/adem.202401917
摘要

Herein, large electrical conductivity of 21% IACS and high strength of 1118 MPa in the Cu‐3.3 wt%Ti alloy are successfully achieved based on the coupling control of microalloying, deformation, and aging. It is revealed that compared with the Mg‐free Cu‐3.3 wt%Ti alloy prepared by traditional treatment methods, such as aging, deformation + aging, and the novel method of preaging + cold rolling + aging, both the addition of 0.1 wt%Mg and the novel method of preaging + cold rolling + aging not only can greatly improve the uniform distribution level of dislocation formed during cold rolling and reduce the average size of precipitates, but also can significantly improve the formation of multiscale precipitates with higher volume fraction and their coupling distribution with dislocations, which effectively improve the electrical conductivity and strengthening contribution of precipitates and dislocation simultaneously. The results shed light on the understanding of related mechanisms in Cu‐Ti alloys and hopefully also provide theoretical guidance for industrial production and applications of Cu‐Ti alloys with excellent properties.
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