材料科学
放电等离子烧结
晶界
热电效应
微观结构
电阻率和电导率
退火(玻璃)
热电材料
塞贝克系数
粒度
掺杂剂
冶金
声子散射
凝聚态物理
热导率
复合材料
光电子学
兴奋剂
热力学
电气工程
物理
工程类
作者
Ting Luo,Federico Serrano‐Sánchez,Hanna Bishara,Siyuan Zhang,Ruben Bueno Villoro,Jimmy Jiahong Kuo,Claudia Felser,Christina Scheu,G. Jeffrey Snyder,James P. Best,Gerhard Dehm,Yuan Yu,Dierk Raabe,Chenguang Fu,Baptiste Gault
出处
期刊:Acta Materialia
[Elsevier BV]
日期:2021-07-04
卷期号:217: 117147-117147
被引量:49
标识
DOI:10.1016/j.actamat.2021.117147
摘要
Science-driven design of future thermoelectric materials requires a deep understanding of the fundamental relationships between microstructure and transport properties. Grain boundaries in polycrystalline materials influence the thermoelectric performance through the scattering of phonons or the trapping of electrons due to space-charge effects. Yet, the current lack of careful investigations on grain boundary-associated features hinders further optimization of properties. Here, we study n-type NbCo1-xPtxSn half-Heusler alloys, which were synthesized by ball milling and spark plasma sintering (SPS). Post-SPS annealing was performed on one sample, leading to improved low-temperature electrical conductivity. The microstructure of both samples was examined by electron microscopy and atom probe tomography. The grain size increases from ~230 nm to ~2.38 μm upon annealing. Pt is found within grains and at grain boundaries, where it locally reduces the resistivity, as assessed by in situ four-point-probe electrical conductivity measurement. Our work showcases the correlation between microstructure and electrical conductivity, providing opportunities for future microstructural optimization by tuning the chemical composition at grain boundaries.
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