Thermal management, solder technology, optoelectronics packaging : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993
作者
William T. Chen,Peter A. Engel
出处
期刊:Eisei Dobutsu [Japan Society of Medical Entomology and Zoology] 日期:1993-01-01