Robust, flexible, and stable CuNWs/MXene/ANFs hybrid film constructed by structural assemble strategy for efficient EMI shielding

Hybrid film in nanoscale with high-flexibility, excellent-mechanical properties and outstanding EMI shielding capacity are desirable for telecommunication systems and precision equipment in aerospace, artificial intelligence and military. Herein, copper nanowire/Ti3C2Tx/aramid nanofibers (CuNWs/MXene/ANFs) hybrid film with uniform-blended, twin-layered and triple-layered structure were developed via in steps vacuum-assisted filtration approach. Benefiting from ANFs building blocks and pleasant interface bonding, the uniform-blended structure film with CuNWs/MXene content of 60 wt% exhibited high-flexibility with folding number of ∼ 2000 times and ideal stability in oxidation resistance and sonication treatment. In addition, due to the layered structure and primordial dense substrate, the triple-layered film with CuNWs/MXene content of 60 wt% demonstrated outstanding mechanical properties with tensile strength of 165.72 MPa and toughness of 15.59 MJ/m3, conductivity of 4475 S·cm−1 and specific EMI effectiveness of 9120.6 dB·cm2·g−1 at thickness of 43 μm (over the whole X band). Particularly, the comprehensive performance of three types of film was synthetically evaluated in seven parameters including SSE/t, toughness, strength, conductivity, thickness, flexibility, and stability, which opened up new evaluation for advance EMI shielding film. The experimental results indicated that the uniform-blended film has excellent potential for efficient, robust, flexible, and stable EMI shielding applications in military, smart electronics and aerospace.