背景(考古学)
光谱分析
半导体
连接(主束)
根本原因分析
光谱分析
签名(拓扑)
根本原因
领域(数学)
物理
光电子学
材料科学
光谱学
工程类
数学
法律工程学
天体物理学
地质学
可靠性工程
机械工程
量子力学
几何学
古生物学
纯数学
作者
Daniel L. Barton,Paiboon Tangyunyong,J.M. Soden,Christopher L. Henderson,Rainer Danz,Reinhard Steiner,Z. R. Iwiński,Edward I. Cole
出处
期刊:
[ASM International]
日期:2000-11-01
卷期号:2 (4): 36-38
被引量:3
标识
DOI:10.31399/asm.edfa.2000-4.p036
摘要
Abstract Recent advances in spectrometers now give sufficient sensitivity to measure the spectral content of the very weak light emission produced by failing semiconductor devices. This article examines light spectra from the most common defect classes in order to demonstrate the strengths and weakness of spectral analysis in the context of semiconductor failure investigations. The conclusion is that signature analysis may not provide a definitive root cause, but it can help confirm the root cause after further analysis is performed.
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