Investigation on the Dynamic Recrystallization Behavior and Microstructure Evolution of Cu-Ni-Si Alloy

The flow stress behavior of Cu-Ni-Si alloy was investigated in the temperature rang of 600～800 ℃ and at strain rate range of 0.01 s-1～5 s-1 on a Gleeble-1500D test machine.The relationship between the flow stress,strain rate and deformation temperature was studied,and the microstructure evolution of the experimental alloy was studied in the hot-compression process.The results show that both strain rate and deformation temperature have large effects on the dynamic recrystallization.The higher temperature and less strain rate easily cause dynamic recrystallization.At the same strain rate,the microstructure is strongly depended on the deformation temperature.The hot deformation activation energy of Cu-Ni-Si alloy during hot deformation is calculated by Arrhenius sinh function,which is 245.4 KJmol-1.