材料科学
电磁屏蔽
相变材料
热导率
复合材料
电磁干扰
传热
复合数
电磁干扰
导电体
潜热
热能储存
热的
工作(物理)
数码产品
热稳定性
散热膏
电子设备和系统的热管理
温度循环
相(物质)
电子元件
强化传热
计算机冷却
热传导
强化传热
柔性电子器件
主动冷却
机械工程
干扰(通信)
热阻
作者
Haocheng Fu,Feng Zhou,Hanqing Liu,Xi Zhang,Zhendong Fu,Yixin Jin,Yan Kou,S. Zhang,Jiao Wang,Nan Yin,Z W Wu,Quan Shi
摘要
ABSTRACT Flexible phase change materials (PCMs) offer a promising strategy for addressing cross‐interface heat transfer and enabling efficient temperature regulation in electronic devices. However, their practical application is hindered by intrinsically low thermal conductivity. Herein, we develop a multifunctional flexible PCM by integrating intrinsically flexible solid‐solid PCM with multidimensional thermally conductive network. Through rational design of the solid‐solid PCMs structure and thermodynamic properties, construction of an efficient heat transfer network, and optimization of the component ratios, the thermodynamic properties, flexibility, and thermal management performance of the multifunctional PCM are systematically balanced. The resulting composite achieves high thermal conductivity of 5.1 W m − 1 K − 1 , satisfactory latent heat density of 63.9 J g − 1 , excellent cycling stability over 1000 heating/cooling cycles, and electromagnetic interference shielding effectiveness up to 74.31 dB, outperforming most previously reported multifunctional flexible PCMs. Moreover, when employed as a thermal interface material in a cooling system, the multifunctional PCM/FAN reduces the device temperature by 27°C, demonstrating a synergistic cooling effect through latent heat storage and enhanced thermal conduction. This work presents high‐performance, multifunctional flexible PCM with integrated thermal management and EMI shielding functionalities, providing a feasible strategy for optimizing the composition and performance balance of flexible PCMs.
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