Silicon carbide: barriers to manufacturable devices
作者
J. Shovlin
标识
DOI:10.1109/asmc.2005.1438790
摘要
Wide band-gap semiconductor materials are attractive candidates for overcoming the limitations of silicon for high voltage/high power devices. SiC devices are beginning to appear in the marketplace; however there are several significant barriers which must be overcome before SiC can become a mainstream semiconductor material. This paper discussed these barriers, and solutions for overcoming them