互连
材料科学
引线键合
光子学
光电子学
复合材料
电信
计算机科学
炸薯条
标识
DOI:10.2961/jlmn.2015.02.0007
摘要
Photonic wire bonding based on direct laser writing of three-dimensional polymer structure was discussed as one of practical approaches for photonic integration of heterogeneous optical components.Here we assessed the coupling efficiency between photonic wire bond and III-V/Si optical components, and demonstrate the fabrication of photonic wire bond between two III-V semiconductor chips.
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